Ticer Technologies will exhibit at DesignCon on February 1-2, 2017, at the Santa Clara Convention Center in Santa Clara, California. Ticer’s booth number is 751.
DesignCon is the premier annual conference for chip, board and systems design engineers in the high-speed communications and semiconductor industries. Now in its 22st year, DesignCon offers state-of-the-art design methodologies, applications and technologies, as well as unparalleled networking opportunities.
The conference was created by engineers for engineers and remains the largest gathering of chip, board and systems designers in the nation. Combining paper sessions, tutorials, industry panels, product demos and exhibits, DesignCon brings engineers the latest on PCB design tools, power and signal integrity, jitter and crosstalk, high-speed serial design, test and measurement tools, parallel and memory interface design, ICs, semiconductor components and more.