Increasing demand for faster processing and improved performance generate new challenges in both the package and printed circuit board designs. Replacement of discrete resistors on the surface of an electronic assembly improves signal routing through the elimination of SMT vias and shorter signal paths. Designs benefit from improved line impedance matching, shorter signal paths and reduced series inductance, elimination of inductive reactance, and reduced EMI, crosstalk and noise. SMT solder joint reduction improves reliability and shortens time to market. If you are striving to reduce form factor, increase the space available for active components, reduce weight or improve performance, TCR® embedded resistor technology is a viable solution. TCR® a Next-Generation thin film resistor foil, meets the ever-increasing challenges of packaging high speed, high-density electronic devices. Manufactured using a thin film vapor deposition, this process ensures the best uniformity of resistor material across the sheet. Greater uniformity delivers higher yields and improved resistor tolerances in multilayer organic packages. Used with existing printed circuit fabrication processes and chemistries, TCR minimizes or eliminates additional equipment needs and shortens learning curves. The TCR Advantage Availability: available as a thin film material from Ticer or as a laminated product through global material suppliers. Compatibility: profiled and tested with a wide variety of resin systems including standard, high performance, lead-free, and specialty resins. It is also ROHS compliant. Design Versatility: NiCr and NCAS alloys available in a range of sheet resistivities enables manufacturing of resistor values from 10 to 100k ohms. Product Performance and Predictability: low thermal coefficient of resistivity minimizes change in TCR foil resistance during lamination. Predictability and consistency lot-to-lot and sheet-to-sheet ensured through extensive testing under varied lamination conditions. Better Resistor Tolerances: precision vacuum metallization targets ensure uniform ratios of the elements in the deposited alloy, resulting in minimal resistance variation. Final etch tolerances benefit from TCR’s thin and uniform resistive layer. Reduces Fabrication Steps: TCR with Nickel Chromium (NiCr) resistor alloy can reduce fabrication steps by eliminating the need for a separate resistive layer etch. Excellent Thermal Stability: minimal resistance change after multiple thermal cycles due to NiCr and Nickel Chromium Aluminum Silicon (NCAS). Designer and user benefit from the thermal dissipation properties of TCR foil. Technical data TCR Integrated Thin Film Resistor Foil is supplied in a variety of foil widths and thicknesses using Grade 3 copper foil which exhibits excellent ductility at elevated temperatures, and withstands stresses near the edge of the plated through holes without cracking. Copper thicknesses of 18 µm (0.5 oz) and 35 µm (1 oz) are commonly available. > Click here to download the product specifications. > Download the TCR brochure by clicking here. > For a detailed data sheet and processing information click here. Zuken and Mentor Graphics design tools and software support the TCR material suite to create links.