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2008	A Case for Multiple Sheet Resistivities for Thin Film Embedded Resistor Packaging Applications Hilburn, R.; Hasegawa, C.; Wang J.
2007	Film Embedded Resistor Processing in Sequential Lamination Printed Circuit Manufacturing Hilburn, R.; Wang, J.; Parsons, D. and Zhang S.
2005	Non-Classical Conductor Losses due to Copper Foil Roughness and Treatment Brist, G.; Hall, S; Clouser, S. and Liang, T.
2003	Power Dissipation of Embedded Resistors Wang, J.; Davis, M.; Hilburn, R. and Clouser, S.
	Stress Effects on Thin Film Nichrome Embedded Resistor Tolerance Wang, J.; Hilburn, R. and Clouser, S.
2002	Manufacturing Embedded Resistors Wang, J.; Hilburn, R.; Clouser, S. and Greenlee, B.
2001	Thin Film Embedded Resistors Wang, J.T. and Clouser, S.J.