TO DOWNLOAD, CLICK ON TITLE.
 |
 |
| 2007 |
Film Embedded Resistor Processing in Sequential Lamination Printed Circuit Manufacturing
Hilburn, R.; Wang, J.; Parsons, D. and Zhang S. |
 |
|
| 2005 |
Non-Classical Conductor Losses due to Copper Foil Roughness and Treatment Brist, G.; Hall, S; Clouser, S. and Liang, T. |
 |
|
| 2003 |
Embedded Capacitance Materials and Their Application in High Speed Designs Bergstresser, T. and Hilburn, R. (Gould Electronics); Obrzut, J. (NIST) and Phillips, K. |
 |
|
|
Power Dissipation of Embedded Resistors Wang, J.; Davis, M.; Hilburn, R. and Clouser, S. |
 |
|
|
Stress Effects on Thin Film Nichrome Embedded Resistor Tolerance Wang, J.; Hilburn, R. and Clouser, S. |
 |
|
| 2002 |
Manufacturing Embedded Resistors Wang, J.; Hilburn, R.; Clouser, S. and Greenlee, B. |
 |
|
| 2001 |
Thin Film Embedded Resistors Wang, J.T. and Clouser, S.J. |
|